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High-speed
mounting capacity handling 45,000CPH(0.08sec/CHIP Equivalent : optimum
condition).
Applicable
to Medium size PCB(L330mm×W250mm).
The
system can handle the 20 lanes feeder banks.
+/-50μm
mounting absolute accuracy in full time operation.
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<Popular
edition>model of YV100Xg is now available in a shorter delivery time and at
a lower price level. The functions and specifications of YV100Xg which has
gained user's confidence and achieved successful results are adjusted and
consolidated into this model.
High-speed mounting capacity handling 20,000CPH(equivalent to 0.18 sec/chip:
optimum condition).
+/-50µm
mounting absolute accuracy in full time operation.
Accommodation
of wide range components, from 0603 to 31mm QFP.
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YV100XE CAN MOUNT 8000pcs. I.C. PER HOUR,WE NEED IT TO
MOUNT DDR, DDR II AND CHIPSET.
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YV112 III CAN MOUNT 15,000pcs. COMPONENT PER HOUR, WE
NEED IT TO MOUNT CAP, RES AND EEPROM.
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YV100 CAN MOUNT 8000pcs. I.C. PER HOUR,WE NEED IT TO
MOUNT EDO, SDRAM, DDR, AND CHIPSET.
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- Making the most of limited foot-print!
- This compact platform design(front view
breadth 1,254mm)assure flexible line arrangement in your site.
- Both new designed 10 inline multi-heads
and new recognition system ensure 36,000CPH(0.1sec/CHIP equivalent :
optimum condition).
- Applicable to large size
PCB(L510mm×W460mm).
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